Semiconductor arrangement and method of manufacture

ABSTRACT

A method of forming a semiconductor arrangement includes forming a gate dielectric layer over a semiconductor layer. A gate electrode layer is formed over the gate dielectric layer. A first gate mask is formed over the gate electrode layer. The gate electrode layer is etched using the first gate mask as an etch template to form a first gate electrode. A first dopant is implanted into the semiconductor layer using the first gate mask and the first gate electrode as an implantation template to form a first doped region in the semiconductor layer.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application62/753,152, titled “SEMICONDUCTOR ARRANGEMENT AND METHOD OF MANUFACTURE”and filed on Oct. 31, 2018, which is incorporated herein by reference.

BACKGROUND

In a semiconductor device, such as a transistor, current flows through achannel region between a source region and a drain region uponapplication of a sufficient voltage or bias to a gate of the device. Thegate is isolated from the channel region by a gate dielectric layer.When current flows through the channel region, the device is generallyregarded as being in an ‘on’ state, and when current is not flowingthrough the channel region, the device is generally regarded as being inan ‘off’ state. As technology nodes shrink, in some integrated circuitdesigns, the gate structure height and width dimensions also shrink. Lowdoped drain (LDD) regions defined in the source/drain regions reduce thelikelihood of hot carrier injection that may potentially damage the gatedielectric layer as the height and width dimensions shrink.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-16 are illustrations of a semiconductor arrangement at variousstages of fabrication, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

One or more techniques for fabricating a semiconductor arrangement areprovided herein. In some embodiments, the semiconductor arrangementcomprises a transistor. In some embodiments, an etch process for forminga gate structure and an implantation process for forming a doped regionadjacent the gate structure are performed using a patterned mask stack.In some embodiments, a sidewall spacer is formed adjacent the gatestructure, and a second dopant is implanted using the first sidewallspacer and the first gate structure as an implantation template to forma second doped region in the semiconductor layer. In some embodiments, adepth of the first doped region is lower than a depth of the seconddoped region relative to a top surface of the semiconductor layer.

Turning to FIG. 1, a plurality of layers used in the formation of asemiconductor arrangement 100 are illustrated, in accordance with someembodiments. FIG. 1 includes a plan view showing where variouscross-sectional views are taken. Referring to FIG. 1, the view X1-X1 isa cross-sectional view taken through the semiconductor arrangement 100in a direction corresponding to a gate length direction through a firstactive region 102A, and the view X2-X2 is a cross-sectional view takenthrough the semiconductor arrangement 100 in a direction correspondingto a gate length direction through a second active region 102B. Not allaspects of the processing shown in the cross-sectional views will bedepicted in the plan view.

In some embodiments, the semiconductor arrangement 100 comprisestransistors. The plurality of layers is formed over a semiconductorlayer 105. In some embodiments, the semiconductor layer 105 is part of asubstrate comprising at least one of an epitaxial layer, a singlecrystalline semiconductor material such as, but not limited to Si, Ge,SiGe, InGaAs, GaAs, InSb, GaP, GaSb, InAlAs, GaSbP, GaAsSb, and InP, asilicon-on-insulator (SOI) structure, a wafer, or a die formed from awafer. In some embodiments, the semiconductor layer 105 comprisescrystalline silicon. In some embodiments, well regions are formed in thesemiconductor layer 105 to define the first active region 102A and thesecond active region 102B. In some embodiments, the well regions are ofdifferent conductivity types. It will be appreciated that in thecross-sectional views, the well regions are not shown to simplifier thedrawings.

In some embodiments, a gate dielectric layer 110 is formed over thesemiconductor layer 105. In some embodiments, the gate dielectric layer110 comprises silicon and oxygen. According to some embodiments, thegate dielectric layer 110 is formed by at least one of thermaloxidation, chemical oxidation, chemical vapor deposition (CVD),including low pressure CVD (LPCVD), plasma enhanced CVD (PECVD),ultra-high vacuum CVD (UHVCVD), reduced pressure CVD (RPCVD), atomiclayer deposition (ALD), physical vapor deposition, pulsed laserdeposition, sputtering, evaporative deposition, vapor phase epitaxy(VPE), molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), orother applicable techniques.

In some embodiments, a gate electrode layer 115 is formed over the gatedielectric layer 110 by at least one of CVD, LPCVD, PECVD, UHVCVD,RPCVD, ALD, physical vapor deposition, pulsed laser deposition,sputtering, evaporative deposition, VPE, MBE, LPE, or other applicabletechniques. In some embodiments, the gate electrode layer 115 comprisespolysilicon.

In some embodiments, a first mask layer 120 is formed over the gateelectrode layer 115. According to some embodiments, the first mask layer120 comprises a plurality of individually formed layers that togetherdefine a first mask stack. In some embodiments, the first mask layer 120comprises a hard mask layer 125 formed over the gate electrode layer 115by at least one of CVD, LPCVD, PECVD, UHVCVD, RPCVD, ALD, physical vapordeposition, pulsed laser deposition, sputtering, evaporative deposition,VPE, MBE, LPE, or other applicable techniques. In some embodiments, thehard mask layer 125 comprises silicon and nitrogen.

In some embodiments, the first mask layer 120 comprises a bottomantireflective coating (BARC) layer 130 formed over the hard mask layer125. In some embodiments, the BARC layer 130 is a polymer layer that isapplied using a spin coating process. In some embodiments, an organicplanarization layer (OPL) 135 is formed over the BARC layer 130. In someembodiments, the OPL layer 135 comprises a photo-sensitive organicpolymer that is applied using a spin coating process. In someembodiments, the OPL layer 135 comprises a dielectric layer.

In some embodiments, the first mask layer 120 comprises a second hardmask layer 137 formed over a region of the semiconductor arrangement 100comprising the second active region 102B while not being formed over thefirst active region 102A. In some embodiments, the second hard masklayer 137 is formed over the first active region 102A and the secondactive region 102B, a mask layer is formed over the second active region102B, an etch process is performed to remove the second hard mask layer137 over the first active region 102A, and then the mask layer formedover the second active region 102B is removed.

According to some embodiments, the first mask layer 120 comprises aphotoresist layer 140 formed over the OPL layer 135 and the second hardmask layer 137. In some embodiments, the photoresist layer 140 is formedby at least one of spinning, spray coating, or other applicabletechniques. The photoresist layer 140 comprises an electromagneticradiation sensitive material and properties, such as solubility, of thephotoresist layer 140 are affected by electromagnetic radiation. Thephotoresist layer 140 is either a negative photoresist or a positivephotoresist. In some embodiments, portions of the OPL layer 135 areirradiated by the electromagnetic radiation that patterns thephotoresist layer 140 are affected to change the etch selectivity of theirradiated portions of the OPL layer 135 with respect to non-irradiatedportions.

Referring to FIG. 2, the first mask layer 120 is patterned to define afirst gate mask 122, in accordance with some embodiments. In someembodiments, the photoresist layer 140 is exposed using a radiationsource and a reticle to define a pattern in the photoresist layer 140.In some embodiments, portions of the photoresist layer 140 are removedto define a patterned photoresist layer 142. In some embodiments, theunderlying OPL layer 135, BARC layer 130, and hard mask layer 125 areetched using the patterned photoresist layer 142 as a template to formthe first gate mask 122 and expose portions of the gate electrode layer115 adjacent the first gate mask 122. In some embodiments, thephotoresist layer 140 remains intact over the second active region 102B,so as to isolate the processing of the second active region 102B fromthat of the first active region 102A.

Referring to FIG. 3, an etching processes is performed to pattern thegate electrode layer 115 over the first active region 102A using thefirst gate mask 122 as an etch template to define a first gate electrode145 over the first active region 102A, in accordance with someembodiments. In some embodiments, the etching process is at least one ofa plasma etching process, a reactive ion etching (RIE) process, or otherapplicable techniques. In some embodiments, the gate dielectric layer110 is not etched when etching the gate electrode layer 115. In someembodiments, the etching process also patterns the gate dielectric layer110 as indicated by the dashed lines. In some embodiments, the chemistryof the etching process may be changed from a first etch chemistry foretching the gate electrode layer 115 and a second etch chemistry foretching the gate dielectric layer 110.

Referring to FIG. 4, an implantation process 150 is performed using thefirst gate mask 122 as an implantation template to implant a firstdopant into the first active region 102A of the semiconductor layer 105and form a first doped region 155 in the semiconductor layer 105 in thefirst active region 102A, in accordance with some embodiments. In someembodiments, the first doped region 155 is a lightly doped drain (LDD)region having a first dopant concentration. In some embodiments, thefirst doped region 155 has a depth 157 greater than a height 160 of thefirst gate electrode 145 as measured from a top surface of thesemiconductor layer 105. Using the first gate mask 122 as theimplantation template allows the first doped region 155 to be formedwith a greater depth 157 without introducing dopant into the gatedielectric layer 110, which can mitigate hot carrier injection andthereby improve hot carrier injection performance issues. In someembodiments, the greater depth 157 of the first doped region 155 resultsfrom the use of a higher implantation energy. The use of the first gatemask 122 as an implantation template allows a complete retrogradejunction to be formed due to the higher implantation energy. In someembodiments, the implantation process 150 is a vertical implantationprocess. Compared to angled implantation processes for forming LDDregions, the use of a vertical implantation process reduces thresholdvoltage mismatches. In some embodiments, the first mask layer 120 inplace over the second active region 102B isolates the second activeregion 102B from the implantation process 150.

In some embodiments, such as where the resulting transistor is an n-typemetal-oxide-semiconductor (nMOS) device, the first doped region 155comprises an n-type impurity, such as phosphorous, arsenic, or adifferent n-type dopant. In some embodiments, such as where theresulting transistor is a p-type metal-oxide-semiconductor (pMOS)device, the first doped region 155 comprises a p-type impurity such asboron, BF₂, or a different p-type dopant. In some embodiments, theimplantation process 150 is performed through the gate dielectric layer110 to protect an upper surface of the semiconductor layer 105 fromimplantation damage.

Referring to FIG. 5, an etch process is performed to remove exposedportions of the gate dielectric layer 110 and removal processes, such asashing, etching, etc., are performed to remove the photoresist layer 140from over the second active region 102B and to remove the patternedphotoresist layer 142, the OPL layer 135, and the BARC layer 130 fromover the first active region 102A, in accordance with some embodiments.The first gate electrode 145 and the remaining portion of the gatedielectric layer 110 define a first gate structure 165. In someembodiments, the first gate structure 165 is a sacrificial, or “dummy”gate structure, which is later removed and replaced with a replacementgate structure comprising a high-k gate dielectric layer and a metalgate electrode.

Referring to FIG. 6, a sidewall spacer 170 is formed adjacent the firstgate structure 165, in accordance with some embodiments. In someembodiments, the sidewall spacer 170 is formed by depositing a conformalspacer layer over the first gate structure 165 and performing ananisotropic etch process to remove portions of the spacer layerpositioned on horizontal surfaces of the hard mask layer 125 and thesemiconductor layer 105. In some embodiments, the sidewall spacer 170comprises the same material as the hard mask layer. In some embodiments,the sidewall spacer 170 comprises nitrogen and silicon. For ease ofillustration and to avoid obscuring the first doped region 155, thesidewall spacer 170 is not illustrated in the plan view.

Referring to FIG. 7, an implantation process 175 is performed using thefirst gate structure 165 and the sidewall spacer 170 as an implantationtemplate to implant a second dopant into the semiconductor layer 105 andform a second doped region 180 in the first active region 102A of thesemiconductor layer 105, in accordance with some embodiments. In someembodiments, the second doped region 180 is formed within the firstdoped region 155 such that the first doped region 155 surrounds thesecond doped region 180. In some embodiments, the second doped region180 is a highly doped source/drain (S/D) region having a second dopantconcentration greater than the first dopant concentration of the firstdoped region 155. In some embodiments, the second doped region 180 has adepth 185 less than the depth 157 of the first doped region 155 asmeasured from a top surface of the semiconductor layer 105. In someembodiments, the first dopant and the second dopant are the same. Insome embodiments, the first mask layer 120 in place over the secondactive region 102B isolates the second active region 102B from theimplantation process 175.

Turning to FIG. 8, in some embodiments, the implantation process 150 toform the first doped region 155, as described with respect to FIG. 4, isperformed prior to etching the gate electrode layer 115, as describedwith respect to FIG. 3. During the implantation process 150 dopant isintroduced into the semiconductor layer 105 through the portions of thegate electrode layer 115 and the gate dielectric layer 110 not coveredby the first gate mask 122. In some embodiments, the energy of theimplantation process 150 is configured to account for the presence ofthe gate electrode layer 115 and the gate dielectric layer 110. In someembodiments, the first doped region 155 has a depth 157 greater than aheight 160 of the first gate electrode 145. Using the first gate mask122 as the implantation template allows the first doped region 155 to beformed with a greater depth 157 without introducing dopant into the gatedielectric layer 110, which can lead to hot carrier injectionperformance issues. In some embodiments, the first mask layer 120 inplace over the second active region 102B isolates the second activeregion 102B from the implantation process 150.

Referring to FIG. 9, the second hard mask layer 137 is removed from overthe second active region 102B and a photoresist layer 195 is formed overthe semiconductor arrangement 100 after the implantation process 175regardless of whether the first doped region 155 is formed prior to theetching of the gate electrode layer 115, as described with respect toFIG. 8, or after the etching of the gate electrode layer 115, asdescribed with respect to FIG. 4. In some embodiments, an etch processis performed to remove the second hard mask layer 137. In someembodiments, the combination of one or more of the photoresist layer195, the OPL layer 135, the BARC layer 130, and the hard mask layer 125formed over the second active region 102B may be referred to as a secondmask layer 200.

Referring to FIG. 10, the second mask layer 200 is patterned to define asecond gate mask 202, in accordance with some embodiments. In someembodiments, the photoresist layer 195 is exposed using a radiationsource and a reticle to define a pattern in the photoresist layer 195.In some embodiments, portions of the photoresist layer 195 are removedto define a patterned photoresist layer 197. In some embodiments, theunderlying OPL layer 135, BARC layer 130, and hard mask layer 125 areetched using the patterned photoresist layer 197 as a template to formthe second gate mask 202 and expose portions of the gate electrode layer115 adjacent the second gate mask 202. In some embodiments, thephotoresist layer 195 remains intact over the first active region 102A,so as to isolate the processing of the second active region 102B fromthat of the first active region 102A.

In some embodiments, due to manufacturing tolerances, the second gatemask 202 overlying the second active region 102B is not perfectlyaligned with the first gate structure 165 overlying the first activeregion 10A, where a perfect alignment would result in a first sidewallof the second gate mask 202 being co-planar with a first sidewall of thefirst gate electrode 145 and a second sidewall of the second gate mask202 being co-planar with a second sidewall of the first gate electrode145. Thus, in some embodiments, there is misalignment between the secondgate mask 202 and the first gate electrode 145, such that the sidewallsof the second gate mask 202 are not co-planar with the sidewalls of thefirst gate electrode 145. As will be described further with respect toFIG. 17, in some embodiments, this misalignment between the second gatemask 202 and the first gate electrode 145 results in alignment variationbetween the first gate structure 165 and a second gate structure 810B,which is formed using the second gate mask 202.

Referring to FIG. 11, an etching processes is performed to pattern thegate electrode layer 115 over the second active region 102B using thesecond gate mask 202 as an etch template to define a second gateelectrode 205 over the second active region 102B, in accordance withsome embodiments. In some embodiments, the etching process is at leastone of a plasma etching process, a reactive ion etching (RIE) process,or other applicable techniques. In some embodiments, the gate dielectriclayer 110 is not etched when etching the gate electrode layer 115. Insome embodiments, the etching process also patterns the gate dielectriclayer 110 as indicated by the dashed lines. In some embodiments, thechemistry of the etching process may be changed from a first etchchemistry for etching the gate electrode layer 115 and a second etchchemistry for etching the gate dielectric layer 110.

Referring to FIG. 12, an implantation process 210 is performed using thesecond gate mask 202 as an implantation template to implant a thirddopant into the second active region 102B of the semiconductor layer 105and form a third doped region 215 in the semiconductor layer 105 in thesecond active region 102B, in accordance with some embodiments. In someembodiments, the third doped region 215 is a lightly doped drain (LDD)region having a third dopant concentration. In some embodiments, thethird doped region 215 has a depth 220 greater than a height 224 of thesecond gate electrode 205 as measured from a top surface of thesemiconductor layer 105. Using the second gate mask 202 as theimplantation template allows the third doped region 215 to be formedwith a greater depth 220 without introducing dopant into the gatedielectric layer 110, which can mitigate hot carrier injection andthereby improve hot carrier injection performance issues. In someembodiments, the greater depth 220 of the third doped region 215 resultsfrom the use of a higher implantation energy. The use of the second gatemask 202 as an implantation template allows a complete retrogradejunction to be formed due to the higher implantation energy. In someembodiments, the implantation process 210 is a vertical implantationprocess. Compared to angled implantation processes for forming LDDregions, the use of a vertical implantation process reduces thresholdvoltage mismatches. In some embodiments, the photoresist layer 195 inplace over the first active region 102A isolates the first active region102A from the implantation process 210.

In some embodiments, such as where the resulting transistor is an n-typemetal-oxide-semiconductor (nMOS) device, the third doped region 215comprises an n-type impurity, such as phosphorous, arsenic, or adifferent n-type dopant. In some embodiments, such as where theresulting transistor is a p-type metal-oxide-semiconductor (pMOS)device, the third doped region 215 comprises a p-type impurity such asboron, BF₂, or a different p-type dopant. In some embodiments, theimplantation process 210 is performed through the gate dielectric layer110 to protect an upper surface of the semiconductor layer 105 fromimplantation damage. In some embodiments, when the first doped region155 comprises a p-type dopant, the third doped region 215 comprises ann-typed dopant. In some embodiments, when the first doped region 155comprises an n-type dopant, the third doped region 215 comprises ap-typed dopant

Referring to FIG. 13, an etch process is performed to remove exposedportions of the gate dielectric layer 110 and removal processes, such asashing, etching, etc., are performed to remove the photoresist layer 195from over the first active region 102A and to remove the patternedphotoresist layer 197, the OPL layer 135, and the BARC layer 130 fromover the second active region 102B, in accordance with some embodiments.The second gate electrode 205 and the remaining portion of the gatedielectric layer 110 define a second gate structure 225. In someembodiments, the second gate structure 225 is a sacrificial, or “dummy”gate structure, which is later removed and replaced with a replacementgate structure comprising a high-k gate dielectric layer and a metalgate electrode.

Referring to FIG. 14, a sidewall spacer 230 is formed adjacent thesecond gate structure 225, in accordance with some embodiments. In someembodiments, the sidewall spacer 230 is formed by depositing a conformalspacer layer over the second gate structure 225 and performing ananisotropic etch process to remove portions of the spacer layerpositioned on horizontal surfaces of the hard mask layer 125 and thesemiconductor layer 105. In some embodiments, the sidewall spacer 230comprises the same material as the hard mask layer. In some embodiments,the sidewall spacer 230 comprises nitrogen and silicon. For ease ofillustration and to avoid obscuring the third doped region 215, thesidewall spacer 235 is not illustrated in the plan view. In someembodiments, the sidewall spacer 235 is also formed adjacent the firstgate structure 165. In some embodiments, the sidewall spacer 235comprises a different material than the sidewall spacer 170 to allowselective removal of the sidewall spacer 235 adjacent the first gatestructure 165 using masking and etching processes.

Referring to FIG. 15, a mask layer 240 is formed above the first activeregion 102A and the first gate structure 165, and an implantationprocess 245 is performed using the second gate structure 225 and thesidewall spacer 170 as an implantation template to implant a fourthdopant into the semiconductor layer 105 and form a fourth doped region250 in the second active region 102B of the semiconductor layer 105, inaccordance with some embodiments. In some embodiments, the mask layer240 comprises a photoresist layer. In some embodiments, the fourth dopedregion 250 is formed within the third doped region 215 such that thethird doped region 215 surrounds the fourth doped region 250. In someembodiments, the fourth doped region 250 is a highly doped source/drain(S/D) region having a fourth dopant concentration greater than the thirddopant concentration of the third doped region 215. In some embodiments,the fourth doped region 250 has a depth 255 less than the depth 220 ofthe third doped region 215 as measured from a top surface of thesemiconductor layer 105. In some embodiments, the third dopant and thefourth dopant are the same. In some embodiments, the mask layer 240 inplace over the first active region 102A isolates the first active region102A from the implantation process 245.

Referring to FIG. 16, the mask layer 240 is removed, in accordance withsome embodiments. In some embodiments, an etch process or an ashingprocess is performed to remove the mask layer 240.

As described herein, the first gate structure 165 and the first dopedregion 155 are formed prior to forming the second gate structure 225 andthe third doped region 215. In some embodiments, the order is reversed,such that the second gate structure 225 and the third doped region 215are formed first. Since the first gate structure 165 and the second gatestructure 225 are formed using separate process flows, an interface 270is defined where the first gate structure 165 contacts the second gatestructure 225. In some embodiments, the interface 270 is defined whereinthe first gate electrode 145 of the first gate structure 165 contactsthe second gate electrode 205 of the second gate structure 225.Moreover, some degree of alignment variation may exist between the firstgate structure 165 and the second gate structure 810B. In someembodiments, a first long axis 275A is defined along a center of thefirst gate structure 165, and a second long axis 275B is defined along acenter of the second gate structure 225. In some embodiments, the firstlong axis 275A is parallel to the second long axis 275B. Due to thealignment variation, the first long axis 275A is laterally offset withrespect to the second long axis 275B.

In some embodiments, the first active region 102A is associated with afirst transistor 280A, and the second active region 102B is associatedwith a second transistor 280B. The first gate structure 165 and thesecond gate structure 225 define a shared gate structure for the firsttransistor 280A and the second transistor 280B because the first gatestructure 165 is electrically coupled to the second gate structure 225due to the first gate structure 165 contacting the second gate structure225 at the interface 270. In some embodiments, the dopant used to formthe first doped region 155 of the first transistor 280A has a firstdopant type, and the dopant used to form the third doped region 215 ofthe second transistor 280B has a second dopant type different from thefirst dopant type. In some embodiments, the first dopant type comprisesan n-type dopant and the second dopant type comprises a p-type dopant.In some embodiments, the first transistor 280A is an nMOS transistor andthe second transistor 280B is a pMOS transistor. In some embodiments,the first transistor 280A and the second transistor 280B define aninverter circuit in a static random access memory (SRAM) cell having ashared gate structure defined by the first gate structure 165 and thesecond gate structure 225.

According to some embodiments, the use of the first gate mask 122 as anetch template for forming the first gate electrode 145, and the use ofthe first gate mask 122 and the first gate electrode 145 as animplantation template facilitates the formation of the first dopedregion 155 with an increased depth resulting from an increasedimplantation energy. The first doped region 155 is formed at theincreased depth without introducing dopant into the gate dielectriclayer 110 and introducing hot carrier injection defects. In someembodiments, the implantation process 150 is a vertical implantationprocess. Compared to angled implantation processes for forming LDDregions, the use of a vertical implantation process reduces thresholdvoltage mismatches. In some embodiments, the use of the second gate mask202 as an etch template for forming the second gate electrode 205, andthe use of the second gate mask 202 and the gate electrode 210 as animplantation template provides similar advantages for the third dopedregion 215.

In some embodiments, a method of forming a semiconductor arrangementincludes forming a gate dielectric layer over a semiconductor layer. Agate electrode layer is formed over the gate dielectric layer. A firstgate mask is formed over the gate electrode layer. The gate electrodelayer is etched using the first gate mask as an etch template to form afirst gate electrode. A first dopant is implanted into the semiconductorlayer using the first gate mask and the first gate electrode as animplantation template to form a first doped region in the semiconductorlayer.

In some embodiments, a method of forming a semiconductor arrangementincludes forming a gate dielectric layer over a semiconductor layer. Agate electrode layer is formed over the gate dielectric layer. A firstgate mask is formed over the gate electrode layer. The gate electrodelayer is etched using the first gate mask as an etch template to form afirst gate electrode. A first dopant is implanted into the semiconductorlayer using the first gate mask as an implantation template to form afirst doped region in the semiconductor layer. The first doped regionextends to a first depth below a top surface of the semiconductor layer.A first sidewall spacer is formed adjacent the first gate electrodeafter implanting the first dopant. A second dopant is implanted usingthe first sidewall spacer and the first gate electrode as animplantation template to form a second doped region in the semiconductorlayer. The second doped region extends to a second depth below the topsurface of the semiconductor layer. The second depth is less than thefirst depth.

In some embodiments, a semiconductor arrangement includes a firsttransistor including a first gate structure over a semiconductor layerand a first doped region in the semiconductor layer adjacent the firstgate structure. A second transistor includes a second gate structureover the semiconductor layer and a second doped region in thesemiconductor layer adjacent the second gate structure. The second gatestructure contacts the first gate structure such that an interface isdefined between the first gate structure and the second gate structure.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand various aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of variousembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

Although the subject matter has been described in language specific tostructural features or methodological acts, it is to be understood thatthe subject matter of the appended claims is not necessarily limited tothe specific features or acts described above. Rather, the specificfeatures and acts described above are disclosed as example forms ofimplementing at least some of the claims.

Various operations of embodiments are provided herein. The order inwhich some or all of the operations are described should not beconstrued to imply that these operations are necessarily orderdependent. Alternative ordering will be appreciated having the benefitof this description. Further, it will be understood that not alloperations are necessarily present in each embodiment provided herein.Also, it will be understood that not all operations are necessary insome embodiments.

It will be appreciated that layers, features, elements, etc. depictedherein are illustrated with particular dimensions relative to oneanother, such as structural dimensions or orientations, for example, forpurposes of simplicity and ease of understanding and that actualdimensions of the same differ substantially from that illustratedherein, in some embodiments. Additionally, a variety of techniques existfor forming the layers, regions, features, elements, etc. mentionedherein, such as at least one of etching techniques, planarizationtechniques, implanting techniques, doping techniques, spin-ontechniques, sputtering techniques, growth techniques, or depositiontechniques such as chemical vapor deposition (CVD), for example.

Moreover, “exemplary” is used herein to mean serving as an example,instance, illustration, etc., and not necessarily as advantageous. Asused in this application, “or” is intended to mean an inclusive “or”rather than an exclusive “or”. In addition, “a” and “an” as used in thisapplication and the appended claims are generally be construed to mean“one or more” unless specified otherwise or clear from context to bedirected to a singular form. Also, at least one of A and B and/or thelike generally means A or B or both A and B. Furthermore, to the extentthat “includes”, “having”, “has”, “with”, or variants thereof are used,such terms are intended to be inclusive in a manner similar to the term“comprising”. Also, unless specified otherwise, “first,” “second,” orthe like are not intended to imply a temporal aspect, a spatial aspect,an ordering, etc. Rather, such terms are merely used as identifiers,names, etc. for features, elements, items, etc. For example, a firstelement and a second element generally correspond to element A andelement B or two different or two identical elements or the sameelement.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others of ordinary skill in the art based upon a readingand understanding of this specification and the annexed drawings. Thedisclosure comprises all such modifications and alterations and islimited only by the scope of the following claims. In particular regardto the various functions performed by the above described components(e.g., elements, resources, etc.), the terms used to describe suchcomponents are intended to correspond, unless otherwise indicated, toany component which performs the specified function of the describedcomponent (e.g., that is functionally equivalent), even though notstructurally equivalent to the disclosed structure. In addition, while aparticular feature of the disclosure may have been disclosed withrespect to only one of several implementations, such feature may becombined with one or more other features of the other implementations asmay be desired and advantageous for any given or particular application.

What is claimed is:
 1. A method of forming a semiconductor arrangement,comprising: forming a gate dielectric layer over a semiconductor layer;forming a gate electrode layer over the gate dielectric layer; forming afirst gate mask over the gate electrode layer; etching the gateelectrode layer using the first gate mask as an etch template to form afirst gate electrode having a first long axis along a center of thefirst gate electrode; implanting a first dopant into the semiconductorlayer using the first gate mask and the first gate electrode as animplantation template to form a first doped region in the semiconductorlayer; forming a second gate mask over the gate electrode layer; etchingthe gate electrode layer using the second gate mask as an etch templateto form a second gate electrode having a second long axis along a centerof the second gate electrode, wherein the second long axis is parallelto the first long axis and the second gate electrode contacts the firstgate electrode; and implanting a second dopant using the second gatemask as an implantation template to form a second doped region in thesemiconductor layer.
 2. The method of claim 1, wherein the first gatemask comprises a hard mask layer and a photoresist layer over the hardmask layer.
 3. The method of claim 2, wherein the first gate maskcomprises a bottom antireflective coating layer over the hard mask layerand a planarization layer over the bottom antireflective coating layer,wherein the photoresist layer is over the planarization layer.
 4. Themethod of claim 1, comprising etching the gate dielectric layer usingthe first gate mask as an etch template.
 5. The method of claim 4,wherein etching the gate dielectric layer comprises etching the gatedielectric layer after implanting the first dopant.
 6. The method ofclaim 1, wherein the second long axis is laterally offset from the firstlong axis.
 7. The method of claim 1, comprising: forming a firstsidewall spacer adjacent the first gate electrode after implanting thefirst dopant; and implanting a third dopant using the first sidewallspacer and the first gate electrode as an implantation template to forma third doped region in the semiconductor layer.
 8. The method of claim7, wherein the first doped region extends to a first depth below a topsurface of the semiconductor layer, the third doped region extends to asecond depth below the top surface of the semiconductor layer, and thesecond depth is less than the first depth.
 9. A method of forming asemiconductor arrangement, comprising: forming a gate dielectric layerover a semiconductor layer; forming a gate electrode layer over the gatedielectric layer; forming a first gate mask over the gate electrodelayer; etching the gate electrode layer using the first gate mask as anetch template to form a first gate electrode; implanting a first dopantinto the semiconductor layer using the first gate mask as animplantation template to form a first doped region in the semiconductorlayer, wherein the first doped region extends to a first depth below atop surface of the semiconductor layer; forming a first sidewall spaceradjacent the first gate electrode after implanting the first dopant; andimplanting a second dopant using the first sidewall spacer and the firstgate electrode as an implantation template to form a second doped regionin the semiconductor layer, wherein the second doped region extends to asecond depth below the top surface of the semiconductor layer, thesecond depth being less than the first depth.
 10. The method of claim 9,comprising etching the gate dielectric layer using the first gate maskas an etch template.
 11. The method of claim 10, wherein etching thegate dielectric layer comprises etching the gate dielectric layer afterimplanting the first dopant.
 12. The method of claim 9, wherein thefirst gate mask comprises: a hard mask layer over the gate electrodelayer; a bottom antireflective coating layer over the hard mask layer; aplanarization layer over the bottom antireflective coating layer; and aphotoresist layer is over the planarization layer.
 13. The method ofclaim 9, wherein implanting the first dopant comprises implanting thefirst dopant before etching of the gate electrode layer.
 14. The methodof claim 9, wherein the first gate electrode has a first long axisdefined along a center of the first gate electrode, and the methodcomprises: forming a second gate mask over the gate electrode layer;etching the gate electrode layer using the second gate mask as an etchtemplate to form a second gate electrode having a second long axisdefined along a center of the second gate electrode, wherein the secondlong axis is parallel to the first long axis and the second gateelectrode contacts the first gate electrode; and implanting a seconddopant using the second gate mask as an implantation template to form asecond doped region in the semiconductor layer.
 15. The method of claim14, wherein the second long axis is laterally offset from the first longaxis.
 16. A semiconductor arrangement, comprising: a first transistor,comprising: a first gate structure over a semiconductor layer; a firstdoped region in the semiconductor layer adjacent the first gatestructure; and a second transistor, comprising: a second gate structureover the semiconductor layer, wherein the second gate structure contactsthe first gate structure such that an interface is defined between thefirst gate structure and the second gate structure; and a second dopedregion in the semiconductor layer adjacent the second gate structure.17. The semiconductor arrangement of claim 16, wherein the first gatestructure has a first long axis defined along a center of the first gatestructure, the second gate structure has a second long axis definedalong a center of the second gate structure, and the first long axis islaterally offset from the second long axis.
 18. The semiconductorarrangement of claim 16, wherein the first doped region comprises afirst dopant having a first dopant type, and the second doped regioncomprises a second dopant having a second dopant type different than thefirst dopant type.
 19. The semiconductor arrangement of claim 16,comprising: a third doped region over the first doped region andcomprising a first dopant concentration higher than a second dopantconcentration of the first doped region, wherein a lowermost depth ofthe first doped region is lower than a lowermost depth of the thirddoped region.
 20. The method of claim 1, wherein etching the gateelectrode layer using the second gate mask as the etch templatecomprises etching the gate electrode layer using the second gate mask asthe etch template after implanting the first dopant.